Live Latency Simulator — Silicon Available Q3 2026

Computation
at the speed of light.

Configure your workload. Watch photonics render GPU latency irrelevant.

1512
HighLow
GPU Cluster
TPU Pod
Photon
Configure your workload above and hit Simulate to begin.
Explore the data
Performance Comparison

Every axis. Photonics wins.

Inference Latency
GPU Cluster
798 µs
Photon
2.7 µs
Speedup
295×
798
GPU
612
TPU
2.7
Photon

Measured on GPT-scale matrix multiplication, batch 32. Photon processes in less than half a nanosecond per MAC operation.

Energy per FLOP
10−17
Joules / FLOP
vs GPU (10⁻¹² J/FLOP)100,000× more efficient
Batch Scaling — Interactive
Batch Size64
1512
GPU Latency
51.1ms
Photon Latency
0.17µs
Thermal Envelope
700W
GPU Node
per accelerator
450W
TPU Pod
per chip
12W
Photon
per module

Near-zero thermal losses from optical signal propagation eliminate active cooling overhead. Photon modules run at ambient datacenter temperature.

Rack Density
0 Tbps
per-rack bandwidth
Photon modules / 1U8
Max TFLOPS / rack960
Watts / TFLOP0.09
Precision Mode
INT8
FP162× memory, higher accuracy
Photon natively supports FP16 and INT8 with on-chip reconfigurable waveguide routing. No software emulation — hardware-level precision switching.
Fabrication Cost
CMOS
Compatible Manufacturing

Built on standard 300mm wafer lines. No exotic materials. Fab cost trajectory mirrors conventional silicon — not III-V compounds.

75% cost parity
Silicon Credibility

Working silicon.
Not a simulation.

A single Photon chip integrates 16,000+ components — modulators, detectors, waveguides, and MZI arrays — fabricated on standard CMOS-compatible silicon. No exotic materials. Ships from any Tier-1 foundry.

16,384
Components

Photon P1 — silicon photonic integrated circuit, 7nm CMOS

On-chip components16,384+
MAC latency< 0.5 ns
Inference accuracy96.2%
Training accuracy96.8%
Bandwidth38 Tbps
Process node7nm CMOS
Wafer size300mm
Compute density10¹⁶ FLOPS/mm²
Accuracy benchmarks on CIFAR-100 and ImageNet validation sets. Photon achieves 96.2% inference accuracy — within 0.3% of FP32 baseline on equivalent GPU hardware.
Waveguide Signal Path
Input Layerλ = 1550nmOutput Layer
Thermal & Energy

Power draw,
measured honestly.

Photon modules run at ambient temperature. No liquid cooling. No overhead cooling budget. The numbers below are wall-socket watts, not TDP ratings.

H100 GPU
700W
TPU v4
450W
A100 GPU
400W
Photon P1
12W
Sustainability note: At scale, shifting 10% of global ML inference to photonic hardware eliminates an estimated 2.4 million tonnes of CO₂ annually — equivalent to removing 500,000 passenger vehicles from the road.
98.3%
Power reduction vs H100
0.12 mJ
Joules per inference
1.02
PUE improvement
🌿
0.4g
CO₂ per 1M inferences
Operating Temperature
85°C
GPU
72°C
TPU
28°C
Photon
Benchmark Access

Run your own benchmark.

Describe your current stack. We provision a simulation environment calibrated to your workload — real hardware results delivered within 48 hours.

No sales call required. Results delivered via email. Read the Whitepaper for methodology.